About
Combining micro-nano manufacturing with engineering practice.
I study Mechanical Engineering at Jilin University and focus on microfabrication and laser fabrication. I keep close ties with Hu Huang’s lab and the Shuji Tanaka MEMS Lab at Tohoku University.
In 2026 I will join Prof. Xianlong Wei’s group at Peking University for Ph.D. studies, continuing the same interests with a stronger experimental toolkit.
Jilin University
2021 – 2026
Tohoku University
2024
Peking University
2026 –
Academic Achievements
IEEJ TEEE
Laser-enabled silicon layer separation
Optimises the laser stealth-cut path to achieve layer separation without a sacrificial layer, remaining compatible with high-temperature semiconductor processes.
Paper ↗Citation: Yao, Y., Vergara, A., Tang, Z., Tanaka, S. “Feasibility Study of Layer Separation using 2D Patterned Internal Laser Damage in Silicon.” IEEJ Transactions on Electrical and Electronic Engineering. https://doi.org/10.1002/tee.70136. © Open-access article
MNC2024
International Microprocesses & Nanotechnology Conference — Oral Presentation
Presented microfabrication solutions and experimental results at MNC 2024 in Kyoto (session 15D-2-3).
Slides ↗Citation: 37th International Microprocesses and Nanotechnology Conference (MNC 2024) oral presentation, Kyoto, The Japan Society of Applied Physics, 15 Nov 2024, session 15D-2-3. © Slides distributed lawfully by the author under the conference agreement.
Actuators
Ultrasonic vibration scratch tester
Proposes a thread–V-groove composite structure with a modal-matching strategy to achieve stable ultrasonic amplitude transmission.
Paper ↗Citation: Huang, Y.; Wu, H.; Yao, Y.; Zhao, H.; Huang, H. “An Ultrasonic Vibration Scratch Tester for Studying the Scratch Characteristics of Materials under Ultrasonic Vibration Contact Status.” Actuators. https://doi.org/10.3390/act13070262. © Open-access article
Utility patent
Ultrasonic vibration device for vibration-assisted scratch testing
Features stable amplitude and easy adjustment, providing a reliable vibration source for vibration-assisted scratch experiments.
Patent ↗Citation: Hu Huang; Yuan Yao; Yaming Huang; Haoxiang Wu. “Ultrasonic Vibration Device for Vibration-Assisted Scratch Testing.” Utility Patent CN 220649966U, China, 22 Mar 2024. © Public record released by CNIPA.
Blog
Westlake University Summer Research
Focused on research-oriented study and conceptual exploration in waveguide and micro-nano fabrication.
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JYPE at Tohoku University
Conducted research training on MEMS fabrication, experiments, and laser process development.
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Innovation Training Program (Ultrasonic Device)
Worked through structural design, simulation, and functional verification for an ultrasonic vibration module.
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Engineering Innovation Competition
Participated in the full workflow of vehicle design, component selection, and assembly debugging.
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Graphics Competition
Engaged in systematic training in engineering drawing and modeling, gaining foundational graphics practice.
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